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UA
PL
Krótka charakterystyka
Gross weight
1.1 kg
Package features / Classification of battery
CL126:NE:2016-12-09
Package features / Composition of battery
CL127:KT:2016-12-09
Package features / Embeeded battery
Yes
Package features / Gross depth (mm)
280 mm
Package features / Gross depth master carton
560 mm
Package features / Gross height (mm)
270 mm
Package features / Gross height master carton
300 mm
Package features / Gross width (mm)
65 mm
Package features / Gross width master carton
360 mm
Package features / Net weight master carton
11 kg
Package features / Packing quantity
10 szt.
Package features / Palette Qty
280 szt.
Package features / Paper/Pasteboard
300.00 g
Package features / PET
2.00 g
Package features / Plastic (No PET)
20.00 g
Package features / Tare weight (kg)
0.32 kg
Package features / Tare weight master carton
1.028 kg
Package features / TI weight (kg)
0.03 kg
Package features / Type of battery
Accumulator
Package features / Volume (m3)
0.004914 m³
Package features / WEEE tax
No
Pamięć / Gniazda pamięci
4
Pamięć / Obsługiwane rodzaje pamięci
DDR4
Praca / Rodzaj płyty
Micro ATX
Praca / Zestaw układów
AMD B
Procesor / Gniazdko procesora
AM4
Procesor / Procesor
Supports 3rd Gen AMD Ryzen processors and future AMD Ryzen processors with BIOS update
Procesor / Typ procesora
AMD
Producer product name
B550M PRO-VDH WIFI
Technical details / Inne funkcje
An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking.
Technical details / Net weight
0.78 kg
Technical details / Producer
MSI
Technical details / Warranty
36 miesiąc
RozwińZwiń
MSI | B550M PRO-VDH WIFI | Rodzina procesorów AMD | Gniazdo procesora AM4 | DDR4 | Gniazda pamięci 4 | Liczba złączy SATA | Chipset AMD B | Micro ATX
W magazynie
Numer produktu: K2_4328
Darmowa dostawa
532,90zł
Bezpieczna dostawa
Darmowa dostawa już od 50 zł
Profesjonalna konsultacja
Gwarancja na każdy produkt
Gwarancja jakości produktów
Wszystkie produkty posiadają oficjalną gwarancję producenta. Zwrotu można dokonać w ciągu 14 dni od zakupu, zgodnie z obowiązującym prawem polskim dotyczącym zwrotów produktów zakupionych online.
Płatność
Gotówka, karta płatnicza, kredyt/rata, rozliczenie bezgotówkowe dla osoby prawnej
Specyfikacja
Opis
Recenzje
Specyfikacja MSI | B550M PRO-VDH WIFI | Rodzina procesorów AMD | Gniazdo procesora AM4 | DDR4 | Gniazda pamięci 4 | Liczba złączy SATA | Chipset AMD B | Micro ATX
Default
Gross weight
1.1 kg
Package features / Classification of battery
CL126:NE:2016-12-09
Package features / Composition of battery
CL127:KT:2016-12-09
Package features / Embeeded battery
Yes
Package features / Gross depth (mm)
280 mm
Package features / Gross depth master carton
560 mm
Package features / Gross height (mm)
270 mm
Package features / Gross height master carton
300 mm
Package features / Gross width (mm)
65 mm
Package features / Gross width master carton
360 mm
Package features / Net weight master carton
11 kg
Package features / Packing quantity
10 szt.
Package features / Palette Qty
280 szt.
Package features / Paper/Pasteboard
300.00 g
Package features / PET
2.00 g
Package features / Plastic (No PET)
20.00 g
Package features / Tare weight (kg)
0.32 kg
Package features / Tare weight master carton
1.028 kg
Package features / TI weight (kg)
0.03 kg
Package features / Type of battery
Accumulator
Package features / Volume (m3)
0.004914 m³
Package features / WEEE tax
No
Pamięć / Gniazda pamięci
4
Pamięć / Obsługiwane rodzaje pamięci
DDR4
Praca / Rodzaj płyty
Micro ATX
Praca / Zestaw układów
AMD B
Procesor / Gniazdko procesora
AM4
Procesor / Procesor
Supports 3rd Gen AMD Ryzen processors and future AMD Ryzen processors with BIOS update
Procesor / Typ procesora
AMD
Producer product name
B550M PRO-VDH WIFI
Technical details / Inne funkcje
An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking.
Technical details / Net weight
0.78 kg
Technical details / Producer
MSI
Technical details / Warranty
36 miesiąc
RozwińZwiń
Pamięć:
Gniazda pamięci - 4
Obsługiwane rodzaje pamięci - DDR4
Procesor:
Typ procesora - AMD
Gniazdko procesora - AM4
Praca:
Rodzaj płyty - Micro ATX
Zestaw układów - AMD B
:
Producer product name - B550M PRO-VDH WIFI
Technical details:
Producer - MSI
Gniazda pamięci - 4
Obsługiwane rodzaje pamięci - DDR4
Procesor:
Typ procesora - AMD
Gniazdko procesora - AM4
Praca:
Rodzaj płyty - Micro ATX
Zestaw układów - AMD B
:
Producer product name - B550M PRO-VDH WIFI
Technical details:
Producer - MSI
Krótka charakterystyka
Gwarancja
2 lata
Maksymalna moc
20W
Materiał
ognioodporny PC
Protokoły szybkiego ładowania
PD3.0
Wejście
AC 200-240V 50/60Hz
Wyjście
Type-C: 20W
Złącze
Type-C
Kolor
Biały
Wymiary
42.4x27.4x80.5mm
Waga
52.9g
Folia hydrożelowa do wszystkich modeli smartfonów – Proove Pro Clear 0,18mm
W magazynie
79,00zł
Darmowa dostawa
Krótka charakterystyka
Producent
Proove
Model
Pro Clear
Rodzaj
Folia hydrożelowa
Stan
Nowy
Gwarancja
14 dni od momentu aplikacji, klejenie za naszym pośrednictwem
Kompatybilność z modelem
Wszystkie modele telefonów
Zgodność z wyświetlaczami Edge
Tak
Stopień ochrony
Wysoki
Rodzaj powierzchni
Błyszcząca
Grubość
0,18 mm (180 mikronów)
Zastosowanie
Przód, tył, camera
Samoregenująca
Nie
Tworzywo
TPU - hydrożel
Dodatkowe opcje
Chroni przed zarysowaniami i uszkodzeniem, Łatwy montaż / demontaż, Nie zmienia czułości na dotyk, Przeźroczysta, Samoregeneracja powierzchni, Zapewnia doskonałą widoczność ekranu
Folia hydrożelowa
Tak
Zestaw do aplikacji
Tak
Informacje prawne
Produkt może różnić się od przedstawionego na zdjęciu, specyfikacja i wyposażenie mogą się zmieniać przez producenta. Szczegóły proszę sprawdzić u menedżera.
Folia hydrożelowa do wszystkich modeli smartfonów – Proove Basic Matte 0,16 mm
W magazynie
64,00zł
Darmowa dostawa
Krótka charakterystyka
Producent
Proove
Model
Basic Matte
Rodzaj
Folia hydrożelowa
Stan
Nowy
Gwarancja
14 dni od momentu aplikacji, klejenie za naszym pośrednictwem
Kompatybilność z modelem
Wszystkie modele telefonów
Zgodność z wyświetlaczami Edge
Tak
Stopień ochrony
Średni
Rodzaj powierzchni
Matowa
Grubość
0,16 mm (160 mikronów)
Zastosowanie
Przód, tył, camera
Samoregenująca
Nie
Tworzywo
TPU - hydrożel
Dodatkowe opcje
Chroni przed zarysowaniami i uszkodzeniem, Łatwy montaż / demontaż, Nie zmienia czułości na dotyk, Matowa, Zapewnia doskonałą widoczność ekranu
Folia hydrożelowa
Tak
Zestaw do aplikacji
Tak
Informacje prawne
Produkt może różnić się od pokazanego na zdjęciu, specyfikacja i wyposażenie mogą zostać zmienione przez producenta. Sprawdź szczegóły u menadżera.
Folia hydrożelowa do wszystkich modeli smartfonów – Proove Basic Clear 0,16 mm
W magazynie
59,00zł
Darmowa dostawa
Krótka charakterystyka
Producent
Proove
Model
Basic Clear
Rodzaj
Folia hydrożelowa
Stan
Nowy
Gwarancja
14 dni od momentu aplikacji, klejenie za naszym pośrednictwem
Kompatybilność z modelem
Wszystkie modele smartfonów
Zgodność z wyświetlaczami Edge
Tak
Stopień ochrony
Średni
Rodzaj powierzchni
Błyszcząca
Grubość
0,16 mm (160 mikronów)
Zastosowanie
Przód, tył, camera
Samoregenująca
Nie
Tworzywo
TPU - hydrożel
Dodatkowe opcje
Chroni przed zarysowaniami i uszkodzeniem, Łatwy montaż / demontaż, Nie zmienia czułości na dotyk, Przeźroczysta, Zapewnia doskonałą widoczność ekranu
Folia hydrożelowa
Tak
Zestaw do aplikacji
Tak
Informacje prawne
Produkt może różnić się od pokazanego na zdjęciu, specyfikacja i wyposażenie mogą zostać zmienione przez producenta. Sprawdź szczegóły u menadżera.
Krótka charakterystyka
Gwarancja
2 lata
Czas pracy
Bez drutu ~15 h
Czujnik
PixArt 3212
Czułość
800-4800DPI
Długość kabla
1.5m
Liczba przycisków
6
Materiał
ABS
Natężenie
3.7V
Odległość połączenia
do 10m
Port
Type-C
Rodzaj przycisków
Huano
Typ połączenia
2.4GHz+USB
Typ akumulatora
Li-ion
Pojemność akumulatora
500mAh
Czas ładowania
~2 h
Kolor
Czarny
Wymiary
60x125x30mm
Waga
90g
Kabel
Type-C
Krótka charakterystyka
Gross weight
1.1 kg
Package features / Classification of battery
CL126:NE:2016-12-09
Package features / Composition of battery
CL127:KT:2016-12-09
Package features / Embeeded battery
Yes
Package features / Gross depth (mm)
280 mm
Package features / Gross depth master carton
560 mm
Package features / Gross height (mm)
270 mm
Package features / Gross height master carton
300 mm
Package features / Gross width (mm)
65 mm
Package features / Gross width master carton
360 mm
Package features / Net weight master carton
11 kg
Package features / Packing quantity
10 szt.
Package features / Palette Qty
280 szt.
Package features / Paper/Pasteboard
300.00 g
Package features / PET
2.00 g
Package features / Plastic (No PET)
20.00 g
Package features / Tare weight (kg)
0.32 kg
Package features / Tare weight master carton
1.028 kg
Package features / TI weight (kg)
0.03 kg
Package features / Type of battery
Accumulator
Package features / Volume (m3)
0.004914 m³
Package features / WEEE tax
No
Pamięć / Gniazda pamięci
4
Pamięć / Obsługiwane rodzaje pamięci
DDR4
Praca / Rodzaj płyty
Micro ATX
Praca / Zestaw układów
AMD B
Procesor / Gniazdko procesora
AM4
Procesor / Procesor
Supports 3rd Gen AMD Ryzen processors and future AMD Ryzen processors with BIOS update
Procesor / Typ procesora
AMD
Producer product name
B550M PRO-VDH WIFI
Technical details / Inne funkcje
An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking.
Technical details / Net weight
0.78 kg
Technical details / Producer
MSI
Technical details / Warranty
36 miesiąc