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UA
PL
Короткі характеристики
Gross weight
1.1 kg
Package features / Classification of battery
CL126:NE:2016-12-09
Package features / Composition of battery
CL127:KT:2016-12-09
Package features / Embeeded battery
Yes
Package features / Gross depth (mm)
280 mm
Package features / Gross depth master carton
560 mm
Package features / Gross height (mm)
270 mm
Package features / Gross height master carton
300 mm
Package features / Gross width (mm)
65 mm
Package features / Gross width master carton
360 mm
Package features / Net weight master carton
11 kg
Package features / Packing quantity
10 szt.
Package features / Palette Qty
280 szt.
Package features / Paper/Pasteboard
300.00 g
Package features / PET
2.00 g
Package features / Plastic (No PET)
20.00 g
Package features / Tare weight (kg)
0.32 kg
Package features / Tare weight master carton
1.028 kg
Package features / TI weight (kg)
0.03 kg
Package features / Type of battery
Accumulator
Package features / Volume (m3)
0.004914 m³
Package features / WEEE tax
No
Pamięć / Gniazda pamięci
4
Pamięć / Obsługiwane rodzaje pamięci
DDR4
Praca / Rodzaj płyty
Micro ATX
Praca / Zestaw układów
AMD B
Procesor / Gniazdko procesora
AM4
Procesor / Procesor
Supports 3rd Gen AMD Ryzen processors and future AMD Ryzen processors with BIOS update
Procesor / Typ procesora
AMD
Producer product name
B550M PRO-VDH WIFI
Technical details / Inne funkcje
An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking.
Technical details / Net weight
0.78 kg
Technical details / Producer
MSI
Technical details / Warranty
36 miesiąc
РозгорнутиЗгорнути
MSI B550M PRO-VDH WIFI Сімейство процесорів AMD Гніздо процесора AM4
В наявності
Код товару: K2_4328
Безкоштовна доставка
532.90zł
Безпечна доставка
Безкоштовна доставка від 50 зл
Професійна консультація
Гарантія на кожний товар
Гарантії на товар
Усі товари мають офіційну гарантію від виробника. Повернення можливе протягом 14 днів після покупки відповідно до чинного законодавства Польщі щодо повернення товарів, придбаних онлайн.
Оплата
Готівкою, банківською картою, в кредит/розстрочку, за безготівковим розрахунком для юр. осіб.
Характеристики
Опис
Відгуки
Характеристики MSI B550M PRO-VDH WIFI Сімейство процесорів AMD Гніздо процесора AM4
Default
Gross weight
1.1 kg
Package features / Classification of battery
CL126:NE:2016-12-09
Package features / Composition of battery
CL127:KT:2016-12-09
Package features / Embeeded battery
Yes
Package features / Gross depth (mm)
280 mm
Package features / Gross depth master carton
560 mm
Package features / Gross height (mm)
270 mm
Package features / Gross height master carton
300 mm
Package features / Gross width (mm)
65 mm
Package features / Gross width master carton
360 mm
Package features / Net weight master carton
11 kg
Package features / Packing quantity
10 szt.
Package features / Palette Qty
280 szt.
Package features / Paper/Pasteboard
300.00 g
Package features / PET
2.00 g
Package features / Plastic (No PET)
20.00 g
Package features / Tare weight (kg)
0.32 kg
Package features / Tare weight master carton
1.028 kg
Package features / TI weight (kg)
0.03 kg
Package features / Type of battery
Accumulator
Package features / Volume (m3)
0.004914 m³
Package features / WEEE tax
No
Pamięć / Gniazda pamięci
4
Pamięć / Obsługiwane rodzaje pamięci
DDR4
Praca / Rodzaj płyty
Micro ATX
Praca / Zestaw układów
AMD B
Procesor / Gniazdko procesora
AM4
Procesor / Procesor
Supports 3rd Gen AMD Ryzen processors and future AMD Ryzen processors with BIOS update
Procesor / Typ procesora
AMD
Producer product name
B550M PRO-VDH WIFI
Technical details / Inne funkcje
An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking.
Technical details / Net weight
0.78 kg
Technical details / Producer
MSI
Technical details / Warranty
36 miesiąc
РозгорнутиЗгорнути
Пам'ять:
Гнізда пам'яті - 4
Підтримувані типи пам'яті - DDR4
Процесор:
Тип процесора - AMD
Гніздо процесора - AM4
Робота:
Тип плати - Micro ATX
Набір мікросхем - AMD B
:
Producer product name - B550M PRO-VDH WIFI
Technical details:
Producer - MSI
Гнізда пам'яті - 4
Підтримувані типи пам'яті - DDR4
Процесор:
Тип процесора - AMD
Гніздо процесора - AM4
Робота:
Тип плати - Micro ATX
Набір мікросхем - AMD B
:
Producer product name - B550M PRO-VDH WIFI
Technical details:
Producer - MSI
Короткі характеристики
Гарантія
2 роки
Вихід
Type-C: 20W
Вхід
AC 200-240V 50/60Hz
Максимальна потужність
20W
Матеріал
Вогнестійкий PC
Протоколи швидкої зарядки
PD3.0
Роз'єм
Type-C
Колір
Білий
Габарити
42.4x27.4x80.5мм
Вага
52.9г
Гідрогелева плівка для всіх моделей смартфонів – Proove Pro Clear 0,18 мм
В наявності
79.00zł
Безкоштовна доставка
Короткі характеристики
Виробник
Proove
Серія
Pro Clear
Тип пристрою
Гідрогелева плівка
Стан
Новий
Гарантія
14 днів з моменту наклеювання, поклейка через наше посередництво
Сумісність з моделлю
Всі моделі телефонів
Сумісність з дисплеями Edge
Так
Ступінь захисту
Високий
Поверхня
Глянцева
Грубина
0,16 mm (160 mikronów)
Місце поклейки
Передня частина, задня частина, камера
Самовідновлювальна
Ні
Матеріл
TPU
Особливості плівки
Захищає від подряпин і пошкоджень, легке встановлення та зняття, не змінює чутливість до дотику, прозора, забезпечує чудову видимість екрана.
Гідрогелева плівка
Так
Комплект для поклейки
Так
Юридична інформація
Товар може відрізнятись від представленого на фото, характеристики та комплектація можуть змінюватися виробником. Подробиці уточнюйте у менеджера.
Гідрогелева плівка для всіх моделей смартфонів – Proove Basic Matte 0,16 мм
В наявності
64.00zł
Безкоштовна доставка
Короткі характеристики
Виробник
Proove
Серія
Basic Матовийte
Тип пристрою
Гідрогелева плівка
Стан
Новий
Гарантія
14 днів з моменту наклеювання, поклейка через наше посередництво
Сумісність з моделлю
Всі моделі телефонів
Сумісність з дисплеями Edge
Так
Ступінь захисту
Середній
Поверхня
Матова
Грубина
0,16 mm (160 mikronów)
Місце поклейки
Передня частина, задня частина, камера
Самовідновлювальна
Ні
Матеріл
TPU
Особливості плівки
Захищає від подряпин і пошкоджень, легке встановлення та зняття, не змінює чутливість до дотику, матова, забезпечує чудову видимість екрана.
Гідрогелева плівка
Так
Комплект для поклейки
Так
Юридична інформація
Товар може відрізнятись від представленого на фото, характеристики та комплектація можуть змінюватися виробником. Подробиці уточнюйте у менеджера.
Гідрогелева плівка для всіх моделей смартфонів – Proove Basic Clear 0,16 мм
В наявності
59.00zł
Безкоштовна доставка
Короткі характеристики
Виробник
Proove
Серія
Basic Clear
Тип пристрою
Гідрогелева плівка
Стан
Новий
Гарантія
14 днів з моменту наклеювання, поклейка через наше посередництво
Сумісність з моделлю
Всі моделі телефонів
Сумісність з дисплеями Edge
Так
Ступінь захисту
Середній
Поверхня
Глянцева
Грубина
0,16 mm (160 mikronów)
Місце поклейки
Передня частина, задня частина, камера
Самовідновлювальна
Ні
Матеріл
TPU
Особливості плівки
Захищає від подряпин і пошкоджень, легке встановлення та зняття, не змінює чутливість до дотику, прозора, забезпечує чудову видимість екрана.
Гідрогелева плівка
Так
Комплект для поклейки
Так
Юридична інформація
Товар може відрізнятись від представленого на фото, характеристики та комплектація можуть змінюватися виробником. Подробиці уточнюйте у менеджера.
Короткі характеристики
Гарантія
2 роки
Відстань підключення
до 10м
Датчик
PixArt 3212
Довжина кабелю
1.5м
Кількість кнопок
6
Матеріал
ABS
Напруга
3.7V
Порт
Type-C
Тип кнопок
Хуано
Тип підключення
2.4GHz+USB
Час роботи
Без дроту ~15 г
Чутливість
800-4800DPI
Тип акумулятора
Li-ion
Ємність аккумулятора
500mAh
Час зарядки
~2 г
Колір
Чорний
Габарити
60x125x30мм
Вага
90г
Кабель
Type-C
MSI B550M PRO-VDH WIFI Сімейство процесорів AMD Гніздо процесора AM4
В наявності
532.90zł
Безкоштовна доставка
Короткі характеристики
Gross weight
1.1 kg
Package features / Classification of battery
CL126:NE:2016-12-09
Package features / Composition of battery
CL127:KT:2016-12-09
Package features / Embeeded battery
Yes
Package features / Gross depth (mm)
280 mm
Package features / Gross depth master carton
560 mm
Package features / Gross height (mm)
270 mm
Package features / Gross height master carton
300 mm
Package features / Gross width (mm)
65 mm
Package features / Gross width master carton
360 mm
Package features / Net weight master carton
11 kg
Package features / Packing quantity
10 szt.
Package features / Palette Qty
280 szt.
Package features / Paper/Pasteboard
300.00 g
Package features / PET
2.00 g
Package features / Plastic (No PET)
20.00 g
Package features / Tare weight (kg)
0.32 kg
Package features / Tare weight master carton
1.028 kg
Package features / TI weight (kg)
0.03 kg
Package features / Type of battery
Accumulator
Package features / Volume (m3)
0.004914 m³
Package features / WEEE tax
No
Pamięć / Gniazda pamięci
4
Pamięć / Obsługiwane rodzaje pamięci
DDR4
Praca / Rodzaj płyty
Micro ATX
Praca / Zestaw układów
AMD B
Procesor / Gniazdko procesora
AM4
Procesor / Procesor
Supports 3rd Gen AMD Ryzen processors and future AMD Ryzen processors with BIOS update
Procesor / Typ procesora
AMD
Producer product name
B550M PRO-VDH WIFI
Technical details / Inne funkcje
An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking., An enhanced PCB design with 2oz thickened copper increases conductivity, improving heat dissipation and performance reliability especially during overclocking.
Technical details / Net weight
0.78 kg
Technical details / Producer
MSI
Technical details / Warranty
36 miesiąc